Category: 2.5D and 3D hybrid integration
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Protecting die-2-die interfaces…
At Sofics we get a lot of questions about the required ESD robustness for the die-2-die (D2D) interfaces between chiplets in a package. People wonder how to select the right ESD standard and what robustness level they need to design for. Sofics has supported several chiplet projects for AI, data…
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Protecting die-2-die interfaces
At Sofics we get a lot of questions about the required ESD robustness for the die-2-die (D2D) interfaces between chiplets in a package. People wonder how to select the right ESD standard and what robustness level they need to design for. Sofics has supported several chiplet projects for AI, data…
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Selecting optimized ESD protection for CMOS image sensors
Today, you can find CMOS image sensors almost everywhere in consumer, automotive, health and security applications. There has been a lot of innovation to enable demanding requirements. The article provides a summary about the 3 main aspects that IC designers need to consider when selecting the ESD protection clamps for…
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Optimized Local I/O ESD Protection in FinFET Technology for 2.5D and 3D hybrid integration
Semiconductor companies using 2.5D and 3D hybrid integration need to consider Electrostatic Discharge (ESD) protection early in the design, even for die-2-die interfaces that remain inside the package. There are several challenges but also opportunities. The use of a local ESD protection clamp at the TSV offers more robustness, higher…