Category: SerDES
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Protecting die-2-die interfaces
At Sofics we get a lot of questions about the required ESD robustness for the die-2-die (D2D) interfaces between chiplets in a package. People wonder how to select the right ESD standard and what robustness level they need to design for. Sofics has supported several chiplet projects for AI, data…
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Protecting die-2-die interfaces…
At Sofics we get a lot of questions about the required ESD robustness for the die-2-die (D2D) interfaces between chiplets in a package. People wonder how to select the right ESD standard and what robustness level they need to design for. Sofics has supported several chiplet projects for AI, data…
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Optimized Local I/O ESD Protection for SerDes In Advanced SOI, BiCMOS and FinFET Technology
Sofics’ 2021 IEDS publication. Semiconductor companies are developing ever faster interfaces to satisfy the need for higher data throughputs. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates low-cap Analog I/Os for high speed SerDes (28Gbps to 112Gbps) circuits created in advanced BiCMOS,…
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Optimized on-chip ESD protection to enable high-speed Ethernet in cars.
In the past most Electronic Control Units (ECU) used CAN and LIN interfaces to connect to sensors, actuators and each other. However, the newest applications need (much) faster communication options. Gigabit automotive ethernet is pushed by many in the industry as the perfect solution. With its local ESD clamp approach,…
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Optimized ESD protection based on Silicon Controlled Rectifiers (SCR), verified on Samsung Foundry 4nm and 8nm FinFET processes
Engineers developing semiconductor devices in the most advanced FinFET technology need improved ESD protection solutions. We demonstrate ESD protection solutions based on proprietary Silicon Controlled Rectifiers verified on the Samsung Foundry 8nm and 4nm FinFET process.
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Optimized Local I/O ESD Protection in FinFET Technology for 2.5D and 3D hybrid integration
Semiconductor companies using 2.5D and 3D hybrid integration need to consider Electrostatic Discharge (ESD) protection early in the design, even for die-2-die interfaces that remain inside the package. There are several challenges but also opportunities. The use of a local ESD protection clamp at the TSV offers more robustness, higher…
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Optimized Local I/O ESD Protection for SerDes In Advanced SOI, BiCMOS and FinFET Technology
Semiconductor companies are developing ever faster interfaces to satisfy the need for higher data throughputs. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates low-cap Analog I/Os for high speed SerDes (28Gbps to 112Gbps) circuits created in advanced BiCMOS, SOI and FinFET nodes.